There is an increasing power and power density demand in space telecom and electronic systems due to a need of higher data through-put and/or miniaturization of components.
The value of a satellite is linked to the amount of data it can process and data processing capacity is limited by the amount of power that can be put through. At the same time, power usage is limited by the equipment temperatures, since above a certain value processors slow down or damage/degradation can occur. Therefore, the cooler electronics are, the more the power can be increased, which leads to more and faster data processing and finally to more revenue from the same equipment.
Lower electronics temperatures are currently achieved by adding thermal straps or heat pipes which add weight and AIT steps, which translate into higher manufacturing and launch costs.
Madrid Space has developed a patented technology to manufacture topologically optimized aluminum structures, balancing mechanical properties and mass while allowing an excellent thermal performance. These structures integrate 2-phase fluid thermal devices, achieving dual optimization of thermal and mechanical performance.
Key benefits include mass savings, reduced AIT (Assembly, Integration, and Testing) effort, and passive cooling capabilities, lowering the temperature of internal electronics and requiring no power.
15-25% less launch cost for the same (optimized) component due to mass reduction
A decrease of maximum temperature by 15-30°C demonstrated by testing which translates into an increase of power through put and equipment/satellite value of 20-47%
The technology can be applied to a wide range of applications:
• frames of PDU, ICUs
• laser communication terminals, high-power scientific instruments: interpherometers, radar -altimeters
• support structure/brackets of optical/rf detectors
• antennae panels
• satellite panels hosting electronic equipment
